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HD49815TF
Digital Camera Signal Processor
ADE-207-316 (Z) 1st Edition Sep. 1999 Description
The HD49815TF is a CMOS IC that has been developed as a digital signal-processing IC for CCD-camera digital-signal-processing systems.
Functions
* * * * * * * * * * * * * * * CCD-sensor drive-pulse generation (TG) Digital AGC (automatic gain control) Color signal separation circuit RGB matrix RGB gain RGB and Y gamma Color-difference matrix Enhancer RGB and Y setup Digital I/F (4:2:2) Zoom control Mirror reversal Synchronization signal generator for encoding (SSG) AWB, AE, and AF detection Two-channel 8-bit D/A converter
Features
* The HD49815TF provides camera-signal processing, TG, SSG, zoom, and D/A functions and other functions in a single chip and supports high system-integration level. * In conjunction with the HD49323AF-01 (CDS/AGC + 10-bit ADC) and the control microcomputer, the HD49815TF forms a three-chip kit that can implement an optimal CCD-camera digital-signalprocessing system. * The HD49815TF provides the zoom function and controls the 1- to 256- times linear zoom. It also provides the half-mirror function.
HD49815TF
Features (cont)
* Since the HD49815TF can be made compatible with the former product, HD49811TFA, through software, a shorter development term is enabled. * Since software controls AWB, AE, and AF, any protocol can be prepared according to the camera shooting conditions. * Programmable TG enables use of any CCD device.
System Block Diagram
HD49815TF Lens CCD HD49323AF-01 CDS/AGC+ 10-bit ADC Input line memory Color processing Luminance processing Microprocessor I/F Zoom processing C-signal output Y-signal output R-Y/B-Y digital output Y-signal digital output
TG SSG V.Driver
Encode DAC
System control
AE (iris) control
AWB (white balance) control
8-bit single-chip microcomputer (H8 series)
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HD49815TF
Pin Arrangement
DSP_MCK
CPREF
XSG2
XSG1
XV4
XV3
XV2
XV1
VDD
XSUB DKF_LD T_CP(TEST) TY_K SDI SDCK SLD SDO EP(1) EP(2) BF HD_IN M_CK VDD VSS FV HD CBLK CSYNC SCBLK HSYNC ID IDP VDD VSS X1I X1O IDS MCK_S RESET
1 2 3 4 5 6 7 8 9
120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62
AD(10)
ADCK
AD(1)
AD(2)
AD(3)
AD(4)
AD(5)
AD(6)
AD(7)
AD(8)
AD(9)
OBP
SP2
SP1
VDD
VDD
VDD
VSS
RG
H2
H1
ZOOM_HD FP NME CPI(1) CPI(2) CPI(3) CPI(4) CPI(5) CPI(6) CPI(7) CPI(8) CPO(1) CPO(2) CPO(3) CPO(4) VSS VDD CPO(5) CPO(6) CPO(7) CPO(8) YPI(1) YPI(2) YPI(3) YPI(4) YPI(5) YPI(6) YPI(7) YPI(8) YPO(1)
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
TFP-120
30 61 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 X2I X2O VSS VSS VSS VSS VSS REXT Y_OUT VSS VR YPO(8) YPO(7) YPO(6) YPO(5) YPO(4) YPO(3) C_OUT NRYBY YPO(2) PLL_P PLL_N DICK AVDD AVDD AVDD CBU FSC CBL VDD
(Top view)
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HD49815TF
Pin Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Symbol XSUB DKF_LD T_CP TY_K SDI SDCK SLD SDO EP (1) EP (2) BF HD_IN M_CK VDD VSS FV HD CBLK CSYNC SCBLK HSYNC ID IDP VDD VSS X1I X1O IDS MCK_S RESET Pin Name CCD shutter pulse Line input LD Test Title SW State data input State data clock State data load pulse AWB, AE, data output AE window pulse 1 AE window pulse 2 Burst flag External CSYNC input Microprocessor clock VCC2 GND Field vertical output HD output Blanking pulse SYNC output SC blanking pulse Horizontal SYNC Identity Identity pulse VCC2 GND X'tal 1 input X'tal 1 output Line ID reset input MCK output SW Reset I/O O I I I I I I O O O O I O -- -- O O O O O O O O -- -- I O I I I Description CCD control pulse Line input dedicated load Test pin (GND input) Title-killer SW (1 = On, 0 = Off) State data-setting data input State data-setting clock State data-latch pulse AWB, AE, and AF detection-data output Iris detection-area-setting pulse: SP-A7 [8] output changeover Iris detection-area-setting pulse: SP-A7 [8] output changeover Burst flag output External CSYNC input Microprocessor clock output (1/2 or 1/4 dividing of X'tal 1) 3.3 V power supply GND Vertical synchronization pulse Horizontal synchronization pulse Blanking pulse SYNC pulse Subcarrier blanking pulse (SECAM) Horizontal SYNC pulse (SECAM) SECAM determination pulse SECAM determination pulse 3.3 V power supply GND 2fsc oscillator input 2fsc oscillator output Line-determination-signal input Pin 13 MCK dividing setting SW (1 = 1/2, 0 = 1/4) Reset: to restore the initial data settings I/O Format ZC2R ICS IC ICD IC ICS ICS ZC2R ICZC2R ICZC2R ICZC2R ICSD OC2R VCCI GNDI ICZC2R ICZC2R ICZC2R ICZC2R ICZC2R OC2R OC2R ICZC2R VCCC GNDC IQ3 OQ3 ICD IC ICS
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HD49815TF
Pin Description (cont)
Pin No. 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 Symbol PLL_N PLL_P VR X2I X2O FSC VSS AVDD VSS AVDD VSS C_OUT CBU CBL REXT Y_OUT VSS AVDD VSS VDD VSS DICK NRYBY YPO (8) YPO (7) YPO (6) YPO (5) YPO (4) YPO (3) YPO (2) YPO (1) YPI (8) YPI (7) YPI (6) Pin Name PLL negative PLL positive Vertical reset X'tal 2 input X'tal 2 output Sub carrier frequency GND Analog V CC2 GND Analog V CC2 GND C analog signal output Current buffer upper Current buffer lower Reference resister EXT Y analog signal output GND Analog V CC2 GND VCC2 GND Digital interface clock R-Y, B-Y phase output Y parallel output (8); MSB Y parallel output (7) Y parallel output (6) Y parallel output (5) Y parallel output (4) Y parallel output (3) Y parallel output (2) Y parallel output (1) ; LSB Y parallel input (8); MSB Y parallel input (7) Y parallel input (6) I/O O O I I O O -- -- -- -- -- O I I I O -- -- -- -- -- O O O O O O O O O O I I I Description PLL signal output PLL signal output Vertical synchronization signal input 4fsc oscillator input 4fsc oscillator output fsc output GND Analog system power supply: 3.3 V GND Analog system power supply: 3.3 V GND Chrominance-signal analog output D/A upper current source D/A lower current source Reference voltage input Luminance-signal analog output GND Analog system power supply: 3.3 V GND Digital system power supply: 3.3 V GND Digital interface clock output Color-difference signal phase clock Luminance-signal digital output MSB Luminance-signal digital output Luminance-signal digital output Luminance-signal digital output Luminance-signal digital output Luminance-signal digital output Luminance-signal digital output Luminance-signal digital output LSB Luminance-signal digital input MSB Luminance-signal digital input Luminance-signal digital input I/O Format ZC2 ZC2 ICSD IQ2 OQ2 ICZC2R GNDA VCCA GNDA VCCA GNDA OA IA IA IA OA GNDA VCCA GNDA VCCI GNDI ICZC2R ICZC2R OC2R OC2R OC2R OC2R OC2R OC2R OC2R OC2R ICD ICD ICD
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HD49815TF
Pin Description (cont)
Pin No. 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 Symbol YPI (5) YPI (4) YPI (3) YPI (2) YPI (1) CPO (8) CPO (7) CPO (6) CPO (5) VDD VSS CPO (4) CPO (3) CPO (2) CPO (1) CPI (8) CPI (7) CPI (6) CPI (5) CPI (4) CPI (3) CPI (2) CPI (1) NME FP ZOOM_HD AD (10) AD (9) AD (8) AD (7) Pin Name Y parallel input (5) Y parallel input (4) Y parallel input (3) Y parallel input (2) Y parallel input (1); LSB C parallel output (8); MSB C parallel output (7) C parallel output (6) C parallel output (5) VCC2 GND C parallel output (4) C parallel output (3) C parallel output (2) C parallel output (1); LSB C parallel input (8); MSB C parallel input (7) C parallel input (6) C parallel input (5) C parallel input (4) C parallel input (3) C parallel input (2) C parallel input (1); LSB Memory HD output Field pulse Zoom HD output AD input (10); MSB AD input (9) AD input (8) AD input (7) I/O I I I I I O O O O -- -- O O O O I I I I I I I I O O O I I I I Description Luminance-signal digital input Luminance-signal digital input Luminance-signal digital input Luminance-signal digital input Luminance-signal digital input LSB Chrominance-signal digital output MSB Chrominance-signal digital output Chrominance-signal digital output Chrominance-signal digital output 3.3 V power supply GND Chrominance-signal digital output Chrominance-signal digital output Chrominance-signal digital output Chrominance-signal digital output LSB Chrominance-signal digital input MSB Chrominance-signal digital input Chrominance-signal digital input Chrominance-signal digital input Chrominance-signal digital input Chrominance-signal digital input Chrominance-signal digital input Chrominance-signal digital input LSB Line memory control output Field pulse Horizontal synchronization signal A/D data input MSB A/D data input A/D data input A/D data input I/O Format ICD ICD ICD ICD ICD OC2R OC2R OC2R OC2R VCCO GNDO OC2R OC2R OC2R OC2R ICD ICD ICD ICD ICD ICD ICD ICD ICZC2DR ICZC2R ICZC2R IC IC IC IC
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HD49815TF
Pin Description (cont)
Pin No. 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 Symbol AD (6) AD (5) AD (4) AD (3) AD (2) AD (1) ADCK CPREF DSP_MCK VDD VSS SP1 SP2 OBP VDD H1 H2 VDD RG VDD XV1 XV2 XV3 XV4 XSG1 XSG2 Pin Name AD input (6) AD input (5) AD input (4) AD input (3) AD input (2) AD input (1); LSB AD clock Clamp reference output Microprocessor clock output VCC2 GND Sampling pulse 1 Sampling pulse 2 OBP pulse VCC1 H1 H2 VCC1 Reset gate VCC2 XV1 XV2 XV3 XV4 XSG1 XSG2 I/O I I I I I I O O O -- -- O O O -- O O -- O -- O O O O O O Description A/D data input A/D data input A/D data input A/D data input A/D data input A/D data input LSB A/D converter clock Clamp reference pulse Microprocessor clock output: SP-A7 [8] output changeover 3.3 V power supply GND Sampling pulse for the AGC/CDS IC Sampling pulse for the AGC/CDS IC Optical black-pulse output 3 V or 5 V power supply (H1/H2 power supply) CCD-sensor horizontal drive pulse CCD-sensor horizontal drive pulse 5 V power supply (RG power supply) CCD-sensor control reset gate 3.3 V power supply CCD-sensor vertical control pulse CCD-sensor vertical control pulse CCD-sensor vertical control pulse CCD-sensor vertical control pulse CCD-sensor vertical control pulse CCD-sensor vertical control pulse I/O Format IC IC IC IC IC IC ICZC2R 2C3 ICZC2R VCCO GNDO ICZC2 ICZC2 ICZC2R VCCC35 OC3R OC3R VCCC5 ZC3R VCCO ICZC2R ICZC2R ICZC2R ICZC2R ZC2R ZC2R
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HD49815TF
Description of I/O Format
I/O Format IC ICD ICS ICSD ICZC2 ICZC2DR ICZC2R OC2R OC3R IQ2 OQ2 IQ3 OQ3 ZC2 ZC2R ZC3 ZC3R VCCI VCCO VCCC VCCC5 VCCC35 GNDI GNDO GNDC IA OA VCCA GNDA Contents CMOS level input CMOS level input with pull-down resistor CMOS level schmitt input CMOS level input with pull-down resistor CMOS level common I/O (4 mA) CMOS level common I/O with pull-down resistor and through-put control (4 mA) CMOS level common I/O with through-put control (4 mA) CMOS level output with through-put control (4 mA) CMOS level output with through-put control (8 mA) Crystal oscillator input Crystal oscillator output Crystal oscillator input Crystal oscillator output CMOS-level three-state output (4 mA) CMOS-level three-state output with through-put control (4 mA) CMOS-level three-state output (8 mA) CMOS-level three-state output with through-put control (8 mA) Core system power supply: 3 V Puddling system power supply: 3 V Common power supply: 3 V Common power supply: 5 V for pin 112 Common power supply: 3 or 5 V for pin 109 Core system GND Puddling system GND Common GND Analog input Analog output Analog power supply Analog GND
Notes: 1. Pin 113 is used for 5 V system output. 2. Pins 110 and 111 are used for 3 V or 5 V system output. They depend on the voltage of pin 109.
8
LPF
LPF
AF detection AE detection
A/D input
SW + LINE SW C-G + WB YL Matrix Axis conversion (WB) Climit PreFilter RGB Matrix RGB Gain Gamma correction Axis conversion Base clipping +
Block Diagram
10-bit
16
De-Knee
AGC
DL
1HDL RGB Setup
Memory control
1HDL
16
X'tal 1
16 H.V enhancer + Luminance correction Gamma correction Highlight enhancer Fade +
16
Timing generator
WB detection
X'tal 2
16 Y Setup SW SW Zoom function Titler Y SW SW Digital interface 16 16 16 16 YPI CPI YPO CPO C BLK SW SW
SSG 7.5IRE
M_CK 16
DSP_MCK 16
to Vdriver 16 CCD
H1, H2, RG, XV1 to 4 XSG1,2, XSUB
8-bit + CLK conversion Y.DAC MOD C.DAC 8-bit Microprocessor interface 16 16 16 16 SDI SLD SDO SDCK
to CDS/AGC 16
ADCK, OBP, SP1 SP2, PBLK
Y out 16 16 C out
FV, CHD etc. 16
FV, HD, MCK, MCKS PLLP, PLLN, fsc, CBLK CP, CSYNC, EP1-3 IDP, SCBLK, etc.
HD49815TF
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HD49815TF
Absolute Maximum Ratings (Ta = 25C)
Item Power supply voltage Pin voltage (5 V operation block) Pin voltage (3 V operation block) Output current Per output Per GND-VCC pair Allowable power dissipation Operating temperature Storage temperature With bias Without bias Symbol VCC Vt5V Vt3V Io Iot Popr Topr Tbias Tstg Ratings -0.2 to +6.8 -0.2 to VCC1 +0.2 -0.2 to VCC2 +0.2 -32 to +32 -72 to +72 450 -10 to +75 -10 to +75 -40 to +125 Unit V V V mA mA mW C C C
Notes: 1. Using this LSI at values in excess of the absolute maximum ratings may permanently damage the LSI. The LSI should normally be operated under the conditions specified for the electrical characteristics. Exceeding these conditions may lead to incorrect operation and may adversely affect LSI reliability. 2. All voltage values are referenced to GND = 0 V. 3. The pin voltage ratings also apply to the NC pins. 4. VCC1 indicates the 5 V system power supply and VCC2 indicates the 3 V system power supply.
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HD49815TF
Electrical Characteristics (VCC1 = 4.75 V to 5.25 V, VCC2 = 2.85 V to 3.15 V, AVCC = 2.85 V to 3.15 V, Ta = 25C)
Test Conditions Item CMOS-level input voltage CMOS schmitt input voltage Output voltage Symbol VIHC VILC VTC + VTC - VOHC1 VOLC1 VOHC2 VOLC2 Input leakage current Output leakage current Pull-down current Power dissipation I LI I LO I PD Popr Min VCC2x0.75 0.0 2.50 0.0 VCC1-0.5 -- VCC2-0.5 -- -- -- 5 -- Typ -- -- -- -- -- -- -- -- -- -- -- -- Max VCC2 VCC2x0.20 VCC2 0.60 -- 0.4 -- 0.4 1.0 1.0 100 450 Unit V V V V V V V V A A A mW VCC1 = 5 V VCC2 = 3 V I OH = -200 A 5 V system pin I OL = 200 A 5 V system pin I OH = -200 A 3 V system pin I OL = 200 A 3 V system pin VIN = 0 V to VCC Output Hi-Z conditions VIN = VCC2 = 3 V VCC1 = 5 V, VCC2 = 3 V, AVCC = 3 V 3 1, 5 1, 6 2 2 1 Note
Analog output voltage (full scale) Analog output voltage (zero scale) Differential linearity
Vfull Vzero DNL
0.80 -0.20 -2.0
1.00 0.00 --
1.20 0.20 2.0
V V LSB
3, 4
Notes: 1. Output voltage must be measured in the steady state. 2. Except for pins that include a pull-down resistor. 3. Guaranteed at CBU = 0.1 F, CBL = 0.1 F, REXT = 3.4 k, analog output load resistance = 500 , and Ta = 25C. 4. Applied to pins indicated as OA in the I/O format column of the pin-functions table. 5. Because V OH of pin 31 cannot be measured logically, it was not tested. 6. Because V OL of pin 32 cannot be measured logically, it was not tested. 7. VCC1, VCC2, and AVCC indicate the 5 V system power supply, the 3 V system power supply, and the analog system power supply, respectively. V CC indicates VCC1, VCC2, and AVCC. 8. The voltage range of pin 109 (VCCC35) is VCC = 2.85 V to 5.25 V.
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HD49815TF
Crystal Oscillation Circuit
1. Measuring conditions The oscillation frequency was measured under the following conditions. VCC1 = 5.0 V VCC2 = 3 V Ta = 25C 8 MHz, 20 MHz, and 24 MHz: Rf = 1 to 10 M Cin, Cout = 20 pF (20 pF) 32 MHz: Rf = 1 to 10 M Cin = 20 pF (20 pF) Cout = 100 pF (20 pF), Co = 15 pF (5 pF), Lout = 1 H The conditions above may be changed within the range of measuring conditions. 2. Measuring method Under the measuring conditions above, two methods were tested. fmin. = 20 MHz, and fmax. = 32 MHz (applied to pins 26 and 27) fmin. = 8 MHz, and fmax. = 24 MHz (applied to pins 34 and 35) Note: The oscillation start time tosc is max. = 200 ms. 3. Measuring circuit
To the internal circuit Xin Xout Dividing counter Cin Co Cout Counter Lout Monitor pin
Note: The part enclosed by the dotted line in the above circuit is used when measuring at 32 MHz.
Figure 1 Measuring Circuit
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HD49815TF
Built-in Functions and System Configuration
System Configuration
HD49815TF Lens CCD HD49323AF-01 CDS/AGC+ 10-bit ADC SP1/2 H1, H2 V.Driver TG SSG Input line memory Color processing Luminance processing Microprocessor I/F Zoom processing C-signal output Y-signal output R-Y/B-Y digital output Y-signal digital output
Encode DAC
XV1 to 4 AGC gain setting System control AE (iris) control
Initial setting resistor input and AE, AWB detection data output AWB (white balance) control
8-bit single-chip microcomputer (H8 series)
Figure 2 System Configuration System Description 1. CCD The following lists the pixels of the CCD sensors that can be used with the HD49815TF. For other pixel numbers, contact our sales dept. 512 (H) x 492 (V) NTSC 512 (H) x 582 (V) PAL 682 (H) x 492 (V) NTSC 681 (H) x 582 (V) PAL 2. CDS/AGC + 10-bit ADC The HD49323AF-01 (manufactured by Hitachi) is recommended as an optimal CDS/AGC + 10-bit ADC IC for the HD49815TF. Since the HD49323AF-01 provides a correlated double sampling circuit that realizes high S/N and an automatic gain control (AGC) circuit that implements programmable control of 0 dB to 34.7 dB, it enables a high-image-quality camera system when used in conjunction with the HD49815TF.
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HD49815TF
3. 8-bit single-chip microcomputer The 8-bit single-chip microcomputer controls the system. It receives the image detection data that the HD49815TF is gathering and implements automatic iris control (AE), automatic white balance control (AWB), and automatic focus control (AF). When setting the power on, this microcomputer implements the initial setting to the state data of the HD49815TF. For details on the state data, see "Hitachi Camera DSP (HD49815TF) State Data". Built-in Functions 1. Input line memory block
A/D input 10-bit 16 De-Knee AGC DL 1HDL 16 Memory control 1HDL + To the color-signal processing block
To the luminance-signal processing block
Figure 3 Input Line Memory Block a. De-knee function When the CDS/AGC IC at the pre-stage or the external circuit uses the knee circuit to expand the dynamic range of the signal, the de-knee (inverse knee) circuit returns the signal converted by the knee circuit to the original state. The de-knee point can be set in State Data SP_A0 [1]. The gain of the high-luminance block is 1/2. b. AGC function A digital AGC circuit is provided. The AGC gain can be set in State Data SP_A0 [2] from 1 to 16 times. c. 1H delay line (1HDL) function This circuit obtains horizontal efficient pixels of the CCD output signal. The number of efficient pixels is set in State Data SP_A0 [9, 10] and TM_A0 [14] MCSET.
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HD49815TF
2. Color-signal processing block
From the input LINE line SW memory block + Climit PreFilter RGB Matrix + RGB Gain To the zoom function
Gamma correction YL Matrix
C-G
Axis conversion Axis conversion (WB)
Base clipping
RGB Setup
WB
To the luminance signal processing block
To the AWB detection block
Figure 4 Color-Signal Processing Block a. C-limit (complementary color clipping level) function High clipping processing is performed on the complementary color signals independently. High clipping is set in State Data SP_A2 [0 to 3]. The complementary color signal indicates Gb: (G + Cy), Wr: (Ye + Mg), Wb: (Mg + Cy), and Gr: (G + Ye). b. RGB-matrix block The three primary colors (red, green, and blue) are acquired in the RGB matrix by multiplying arbitrary coefficients by the four complementary colors (Gb, Wr, Wb, and Gr) and taking the total of those results. The RGB matrix is designed to support the minimum color moire and to enable free color reproduction. Arbitrary coefficients are set in State Data SP_A2 [4 to 15]. The following shows the formula.
R KRa KRb KRc KRd B = KBa KBb KBc KBd G KGa KGb KGc KGd Gb Wr Wb Gr
State Data SP_A2 [4 to 15]
c. RGB-setup block The black level of the color signals is variable according to the coefficients of the RGB matrix. The value calculated by the formula below is subtracted from the color signal to correct the black level. The subtracted value can be set externally and is set in State Data SP_A3 [0 to 2].
Formula = -[48 x (Matrix data) x 23]
d. RGB-gain block The RGB gain value acquired in the AWB control is set in the RGB gain circuit to improve the white reproduction performance. As it is set prior to the gamma correction, it changes the gamma correction amount. The RGB gain can be set in State Data SP_A3 [3 to 5] from 1 to 256 times. (The G gain is set from 1 to 128 times.)
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HD49815TF
e. C gamma () correction block The C gamma correction circuit performs gamma processing on the RGB signal. It is set in State Data SP_A3 [6 to 9]. Four kinds of values can be set independently, according to the input-signal level, to acquire optimal gamma characteristics: the C gamma dark (to reduce the gain of the small signals for improving S/N), C gamma coefficient (to control the expansion of the gamma curve), C gamma knee (to decide the slope of the large signals), and C gamma limit (to perform high-clipping processing for the input signal of the C gamma circuit). f. YL matrix block The luminance level changes according to the color temperature of the imaged object. Set State Data SP_A5 [12, 13] for the luminance correction. To correct the luminance, create YL from the three primary colors (R, G, and B) and convert it to the luminance signal level. The YL matrix circuit creates the YL level from the RGB signal. The YL matrix is set in State Data SP_A3 [11 to 13]. g. The axis-conversion (C-Y matrix) block The C-Y (color-difference) matrix takes R-G and B-G as its input signals, and creates the R-Y and B-Y color-difference signals by setting coefficients for those inputs. The axis-conversion (C-Y matrix) circuits are set in State Data SP_A8 [0 to 5]. h. Base-clipping block Since base clipping is performed on the color-difference signals, the base-clipping circuit has the characteristics of clipping the sections near axes on a vector scope. This circuit is set in State Data SP_A8 [8]. 3. Luminance-signal-processing block
from YL matrix From the input line memory block Gamma correction To the AWBdetection block Highlight enhancer + To the zoom function
H.V enhancer
Luminance correction
+
Fade
Y Setup
7.5IRE
Figure 5 Luminance-Signal-Processing Block a. H-enhancer function The H-enhancer circuit allows the core level, the enhancer gain, and the noise coefficient to be set independently to acquire optimal characteristics. This circuit is set in State Data SP_A4 [4 to 7]. b. V-enhancer function The V-enhancer circuit allows the enhancer coefficient to be set and can control the gain for only those signal components that exceed the set core level. This circuit is set in State Data SP_A4 [8 to 10].
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HD49815TF
c. Luminance correction The ratio of the red and blue levels changes according to the color temperature of the imaged object. For example, if a red object is imaged at a low color temperature, the luminance level increases and the object appears to have a lower chrominance. Therefore, the luminance correction circuit performs luminance-correction processing to implement color depth reproduction. The luminance-correction circuit is set in State Data SP_A5 [12, 13]. d. Y setup Since the OB clamp processes the signal, the black level of the 10-bit signal input to the HD49815TF is fixed to 48/1024. The Y-setup circuit subtracts 48 at the black level. However, when 48 at the black level differs due to the noise mixed in the analog signal, the Y-setup circuit subtracts that value. The Y-setup circuit is set in State Data SP_A5 [6]. e. Gamma correction The gamma-correction circuit implements the gamma-correction processing for the separated Y signal. Four kinds of values can be set independently, according to the input-signal level, to acquire optimal gamma characteristics: the gamma input limit, the gamma knee coefficient, the gamma coefficient, and the gamma black clipping. The gamma correction circuit is set in State Data SP_A5 [1 to 4]. f. Highlight enhancer For input-Y signal levels in excess of 100 IRE, the highlight enhancer implements highlight enhancer processing. This circuit is set in State Data SP_A5 [0, 5, and 14]. g. Fade The fade circuit amplifies the luminance signal by a factor of 0 to 1. This circuit is set in State Data SP_A5 [9]. 4. Zoom, encode block, TG, SSG, and AWB and AE detection blocks a. Zoom processing The Y, R-Y, and B-Y signals completed the color-signal processing and the luminance-signal processing can be electronically zoomed by a factor of 1 to 256. After clipping CCD signals for V direction, zoom circuit clips these signals for H direction, and expand these signals for H and V directions. The zooming times and the read starting position for the V and H directions are set in State Data TM_A2 [3, 4, 5, 6, 8, and 9] and ZM_A0 to 6. b. Encode block This circuit encodes the signals completed the color-signal processing, the luminance-signal processing, and the zoom processing as the NTSC/PAL TV-monitor method. A DAC that converts the digital signal to an analog signal is provided. The DAC has two channels: one for R-Y signals and one for B-Y signals.
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HD49815TF
c. TG and SSG The TG generates the signals required to drive the CCD sensor (H1, H2, RG, SG1/2, and the V transfer pulse), and the CDS/AGC control signals (SP1 and SP2). In addition, the SSG generates the signals to synchronize with the TV monitor (the Sync signal). The drive timing of the generated signals differs according to the manufacturer and the specifications of the CCD sensor. Setting the state data enables setting of any timing. The state data of TG and SSG can be set in TM_A0, A1, A2, A3, and A8. d. AWB- and AE-detection blocks The HD49815TF provides automatic white-balance (AWB) and automatic-iris (AE) detection circuits that are indispensable for a camera. The AWB-detection block takes the R-Y and B-Y color-difference signals completed the colorsignal processing, and converts to the R-B and MG-G axes. The converted signals are sent to circuits for the white detection to obtain white signal components only, and the white-color difference value is detected. The 8-bit single-chip microcomputer acquires this detection data, and controls the R and B gains to produce the true white. The State Data of the AWB detection is AWB_A0 and A8. The AE-detection block divides the CCD output signal converted to digital by the 10-bit ADC to six arbitrary areas, and performs integration processing. This function enables detection of the lighting level of the image signal. The 8-bit single-chip microcomputer acquires this detection data, and controls the accumulation amount (the shutter) of the CCD sensor or the iris motor of the lens to maintain the proper lighting. The State Data of the AF detection is AE_A0 to A7 and A8.
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HD49815TF
Microcomputer Interface Specifications
* Write format SLD (Pin 7) SDCK (Pin 6)
LSB MSB LSB MSB LSB MSB
SDI (Pin 5)
D1 D2 D3 D4 D5 D6 D7 D8
D1 D2 D3 D4 D5 D6 D7 D8 D1 D2 D3 D4 D5 D6 D7 D8
1 byte Data (N byte) STD3-----STH2-----STD1 * Read format SLD (Pin 7) SDCK (Pin 6)
LSB MSB LSB
Address STAL STAH
Function address (write address)
MSB
SDI (Pin 5)
D1 D2 D3 D4 D5 D6 D7 D8 D1 D2 D3 D4 D5 D6 D7 D8
STAL SDO (Pin 8)
Hi-Z
1 byte or 2 byte Function address STAH
LSB MSB Hi-Z
Data (N byte) Notes: 1. 2. 3. 4. Synchronous serial transfer (The microcomputer serial port can be used.) Transfer frequency: 3.58 MHz or lower Data and address are handled in a byte unit. The clock and load pulse are used in common for read/write.
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HD49815TF
Data Transfer Specification
For data transfer between the HD49815TF and the microcomputer, two types (N and E for write, and R1 and R2 for read) are available. The following table shows the relationship between the function block and the transfer specifications. On the next page, the details of the transfer specifications are described.
Function Block Signal processing TM Transfer Mode W W Transfer Specifications *1 N N E R Iris W R White balance W R AF W R ZOOM Note: W R1 N R2 N R1 N R1 N Related Address SP_A0, 2 to 5, 7 to 10, 15 TM_A3, 15 TM_A0 to 2, 8, 10 to 12 TMR_A0 AE_A0 to 7 AE_A8 AWB_A0 AWB_A8 AF_A0 to 3 AF_A8 to 13 ZM_A0 to 6
1. Transfer specifications Type N : Normal transfer from the microcomputer to the DSP Type E : Transfer using the set pulse (synchronous with VD) or the reset signal (used as a synchronous pulse in the DSP) sent from the microcomputer to the RS latch in the DSP Note: This cannot be set during the standby mode. Type R1 : Data transfer (1) from the DSP to microcomputer Type R2 : Data transfer (2) from the DSP to microcomputer
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HD49815TF
* Type N
Transfer specification SLD (Pin 7) N SDCK (Pin 6) A B C A = 100 ns or more B = 100 ns or more C = 100 ns or more Pulse Timing Conditions
* Type E
Transfer specification SLD (Pin 7) E SDCK (Pin 6) A B D Pulse Timing Conditions 270,000 pixels 150 ns A 0.5 / fs + 100 ns or more or more 300 ns B 2 / fs + 100 ns or more or more 650 ns D 5.5 / fs + 100 ns or more or more fs Sensor clock 100 ns
410,000 pixels 135 ns or more 240 ns or more 485 ns or more 70 ns
* Type R1
Transfer specification SLD (Pin 7) R1 SDCK (Pin 6) A B D Pulse Timing Conditions A = 100 ns or more B = 100 ns or more D = 400 ns or more Do not read the white balance data and the AF read data within the 1H period from the start of the V blanking.
* Type R2
Transfer specification SLD (Pin 7) R2 SDCK (Pin 6) A B D Pulse Timing Conditions A = 100 ns or more B = 100 ns or more 270,000 pixels 4.1 s or more 100 ns 410,000 pixels 2.99 s or more 70 ns
D {1 / fs x (32 + 5) + 400 ns} or more fs Sensor clock
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HD49815TF
Note: 2 to 9. Function addresses The following table shows the function addresses for each function block (during state data transfer) and the data to be transferred from the microcomputer.
Table 2 Function Addresses for each Function Block and State Data
List of Data Transferred
2 Function Address STAH STAL STD1 STD2 Signal D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 processing 00000000 (Setting example) 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 1 D8 D7 D6 D5 D4 D3 D2 D1 D9 3 Function Address STAH STAL STD1 STD2 TM write D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 00000001 (Setting example) 0 0 0 0 0 0 0 1 0 0 0 0 1 1 1 0 D8 D7 D6 D5 D4 D3 D2 D1 Function Address 4 TM read D8 D7 D6 D5 D4 D3 D2 D1 Data read for automatic phase adjustment for SP1, SP2, and RG 00001001 Function Address ADATA STAH STAL STD1 STD2 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 0 0 0 1 0 0 0 0 0 0 0 0 0 5 0 0 0 1 0 1 0 0 D3 D2 D1 0 0 0 0 0 0 0 0 STAH STAL STD1 STD2 W Function Address ADATA AE D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 0 0 0 0 0 0 0 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 1 0 0 0 1 0 D5 D4 D3 D2 D1 0 0 0 0 0 0 0 0 Function Address STAH STAL 6 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 Read area setting by STAL (4 bits) R 0 0 0 1 1 0 0 0 Function Address ADATA STAH STAL STD1 STD2 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 0 0 1 0 0 0 0 0 0 0 0 0 0 7 0 0 1 0 0 0 0 0 0 1 D6 D5 D4 D3 D2 D1 0 0 0 0 0 0 0 0 W Function Address ADATA STAH STAL STD1 Window setting AWB D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 for white balance WB detection 0 0 0 0 0 0 0 axis phase setting 0 0 0 0 0 0 0 1 1 0 1 1 0 0 1 1 D8 D7 D6 D5 D4 D3 D2 D1 Function Address 8 D8 D7 D6 D5 D4 D3 D2 D1 White balance read R 00101000 Function Address ADATA STAH STAL HPF bandwidth selection D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 00110 Base-clip quantity setting, etc. 9 0 0 1 1 0 0 0 0 D4 D3 D2 D1 STAH STAL STD1 W Function Address ADATA AF D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 D8 D7 D6 D5 D4 D3 D2 D1 Setting for integration and display gate 0000000111000 0 0 0 0 0 0 0 1 1 1 0 0 0 1 0 1 D8 D7 D6 D5 D4 D3 D2 D1 Function Address 10 D8 D7 D6 D5 D4 D3 D2 D1 Vf fetch address (read_cycle) R 00111 Header Data 1 Data 2 Data 3 D8 D7 D6 D5 D4 D3 D2 D1 10110 ZOOM W Data 4 Data 5 Data 6
Remarks
This example is related to SP-A0[9]. This example is related to TM-A0 [14].
This example is related to the IRIS peak detection area. This example is related to the window H count 3.
This example is related to the offset R-B. This example is related to the V count 2.
This example is related to the HRF bandwidth selection. This example is related to the differential gate of V-end.
Note: For the ZOOM, the transfer of in total of seven bytes is required for the header and data 1 to 6.
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HD49815TF
Digital Interface Timing
* The output specification and timing of the digital interface output (Y, R-Y, B-Y) NRYBY
DICK
4 : 2 : 2 output timing CPO (1 to 8) R-Y0 B-Y0 R-Y2 B-Y1 R-Y4 B-Y4
YPO (1 to 8)
Y0
Y1
Y2
Y3
Y4
Y5
* Detailed specifications of digital interface timing X'tal CLK 35 nsec DICK output 2 to 15 nsec CPO, YPO 10 to 50 nsec CPI, YPI 70 nsec
NRYBY (Reference) NRYBY DICK CPO, YPO CPI, YPI
20 to 35 nsec
: R-Y/B-Y determination pulse : Clock dedicated to the digital interface (The clock generated from the external X'tal.) : Digital interface output terminal : Digital interface input terminal
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HD49815TF
Package Dimensions
Unit: mm
16.0 0.2 14 90 91 16.0 0.2 61 60
120 1 *0.17 0.05 0.15 0.04 30
31 *0.17 0.05 0.15 0.04 1.20 Max
1.00
0.07 M 1.2
0.4
1.0 0 - 8 0.5 0.1
0.10
0.10 0.10
*Dimension including the plating thickness Base material dimension
Hitachi Code JEDEC EIAJ Weight (reference value)
TFP-120 -- Conforms 0.5 g
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HD49815TF
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL
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Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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